50.化学前处理,化学研磨：Chemical Milling 

51.选择性浸金压膜：Selective Gold Dry Film Lamination

52.镀金：Gold plating

53.喷锡：Hot Air SolderLeveling

54.成型：Profile/Form

55.开短路测试：Electrical Testing

56.终检：Final VisualInspection

57.金手指镀镍金：Gold Finger 

58.电镀软金：Soft Ni/Au Plating

59.浸镍金：Immersion Ni/Au / Electroless Ni/Au

60.喷锡:Hot Air Solder Leveling 

61.水平喷锡:HorizontalHot Air Solder Leveling    

62.垂直喷锡: Vertical Hot Air Solder Leveling  

63.超级焊锡:Super Solder

64.印焊锡突点:Solder Bump

65.数控铣/锣板：N/C Routing/Milling

66.模具冲/啤板：Punch

67.板面清洗烘烤：Cleaning & Backing

68.V型槽/V-CUT： V-Cut/V-Scoring

69.金手指斜边：Beveling of G/F

70.短断路测试Electrical Testing/Continuity & Insulation Testing  

71.AOI 光学检查：AOI Inspection

72：VRS 目检：Verified & Repaired

73.泛用型治具测试：Universal Tester

74.专用治具测试：Dedicated Tester

75.飞针测试：Flying Probe

76.终检：Final Visual Inspection 

77.压板翘：Warpage Remove

78.X-OUT 印刷：X-Out Marking