18.迭板:Lay up    

19.压合:Lamination     

20.后处理:Post Treatment     

21.黑氧化:Black Oxide Removal   

22.铣靶:spot face    

23.去溢胶:resin flush removal

24.减铜：Copper Reduction

25.水平电镀：HorizontalElectrolytic Plating

26.电镀：Panel plating

27.锡铅电镀:Tin-Lead Plating /Pattern Plating   

28.低于 1 mil: Less than 1 mil Thickness 

29.高于 1 mil:More than 1 mil Thickness 

30.砂带研磨:Belt Sanding  

31:剥锡铅:Tin-Lead Stripping

32.微切片: Microsection

33.蚀铜:Etching       

34.初检:Touch-up

35.塞孔：Plug Hole

36.防焊(绿漆/绿油)：SolderMask

37.C面印刷:Printing Top Side  

38.S面印刷:Printing Bottom Side 

39.静电喷涂:Spray Coating 

40.前处理:Pretreatment  

41.预烤:Precure

42.后烘烤:Postcure

43.印刷:Ink Print

44.表面刷磨:Scrub

45.后烘烤:Postcure

46.UV烘烤:UV Cure  

47.文字印刷:Printing of Legend   

48.喷砂:Pumice/Wet Blasting 

49.印可剥离防焊/蓝胶:Peelable Solder Mask)